Wed, Oct 30 2013
LeTourneau University associate professor of mechanical engineering Dr. Scott Anson recently presented at the Surface Mount Technology Association International conference in Fort Worth. SMTAi is the premier technical conference and equipment exhibition in the electronics manufacturing industry.
Anson’s paper was titled “Evaluation of Solder Pastes for High Reliability Applications” and explored the manufacturability of various commercially available solder pastes which are used in high reliability products such as medical devices, communications and military products.
Solder paste is a combination of 1) alloy for metallurgical bonding, 2) flux for oxide removal during thermal processing, and 3) viscosity modifiers to allow automated paste deposition. The paper was published in the conference proceedings.
Anson coauthored the research with two of his former students who are now employees at IEC Electronics in Newark, N.Y. They are Michael McLaughlin, a lead process engineer, and Abner Argueta, a materials lab technician.